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STA210N
Sirius Satellite Digital audio radio service Heterodyne tuner
Data Brief
Features

2.3 GHz to 76.5 MHz down-converter High-performance single signal path for satellite and terrestrial signals Operation in the 2320 to 2345 MHz band Low-power consumption, 3.3V operation On-chip PLL with lock flag Fractional synthesizer including integrated VCO Direct Xtal connection High-Performance Linear RF/IF AGC Low cost external components IIC-bus slave control interface The STA210N is assembled in a VFQFPN68 package. The front-end architecture is a down converter (see Figure 1), with one RF down conversion path, with an on chip image frequency suppression, on chip AGC system, and one IF variable gain path. The IF output is usable for IF sampling architecture. The front-end processes both satellite and terrestrial signals. The IC is able to split the three Sirius broadcast component signals into their respective subbands via three different SAW filters. The STA210N includes all the RF functions up to IF, and it manages the signals going to and coming from the base-band. VFQFPN68
Description
The STA210N is an RF IC using STMicroelectronics BiCMOS6G SiGe Technology, for a one chip solution for digital satellite and terrestrial radio receiver.
Table 1.
Device summary
Temp range, C -40 to +85C Package VFQFPN68 Packing Tray
Part number STA210N
June 2007
Rev 1
1/6
www.st.com 6
For further information contact your local STMicroelectronics sales office.
Application block diagram
STA210N
1
Application block diagram
Figure 1. Application block diagram
FLASH 1M x 16
STA210N Tuner FE
IF I2C IFAGC
STA240 STA240 Baseband Baseband Processor Processor
Audio/I 2S
Data
SDRAM 8Mbx8 or 16Mx8
AC00142
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STA210N
Electrical specifications
2
2.1
Electrical specifications
Thermal data
Table 2. Symbol
Rth j-amb
Thermal data Parameter
Thermal resistance junction-ambient (1): T yp. Max.
Value
20 25
Unit
C/W
1. on multi-layer JEDEC test board
2.2
Absolute maximum ratings
Table 3. Symbol
Tstg Tfunc Top Tj-max Tlead Tslope Humid VMax VMin VESD PRFmax
Absolute maximum ratings Parameter
Storage temperature Functional ambient temperature Operating ambient temperature Maximum junction temperature Lead temperature (soldering,10s) Temperature slope Humidity Maximum voltage on each pin Minimum voltage on each pin Electrostatic discharge voltage HBM (ESD) Max RF input power +15 GND-0.3 2 -10
Min.
-40 -40 -40
Typ.
Max.
125
Unit
C C C C C C/min % V V kV dBm
25 25
100 85 125 260 10 85 3.6
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Package information
STA210N
3
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: http://www.st.com. Figure 2. VFQFPN68 mechanical data and package dimensions
mm DIM. MIN. A1 A2 A3 b D D1 D2 E E1 E2 e L P ddd 0.45 7.55 7.55 9.85 0.18 9.85 TYP. 0.02 0.65 0.20 0.25 10.00 9.75 7.7 10.00 9.75 7.7 0.50 0.55 7.85 7.85 MAX. 0.05 1.00 MIN. TYP. MAX. inch
OUTLINE AND MECHANICAL DATA
0.0008 0.0020 0.0256 0.0394 0.0079
0.30 0.0071 0.0098 0.0118 10.15 0.3878 0.3937 0.3996 0.3839 0.2972 0.3031 0.3091
10.15 0.3878 0.3937 0.3996 0.3839 0.2972 0.3031 0.3091 0.0197 0.65 0.0177 0.0217 0.0256 0.60 0.08 0.0236 0.0031
VFQFPN68 (10x10x1.0mm, pitch 0.50) Very Fine Quad Flat Package No lead
7479590_C
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STA210N
Revision history
4
Revision history
Table 4.
Date 6-Jun-2007
Document revision history
Revision 1 Initial release. Changes
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STA210N
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